ASAP Semiconductor

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Browse Pad, Spring products in Aviation.

Manufacturers

Parts

#Part #NameRFQ
11045-15GENERAL CHARACTERISTICS ITEM DESCRIPTION: BRASS; 0.860 IN. DIA; 0.165 IN. H
21045-15GENERAL CHARACTERISTICS ITEM DESCRIPTION: BRASS; 0.860 IN. DIA; 0.165 IN. H
31017-28GENERAL CHARACTERISTICS ITEM DESCRIPTION: B0.827 IN. O/A OD,0.412 IN. SMALLEST OD,0.068 IN. THK LARGEST OD,0.092 IN. THK SMALLEST OD,LARGE ST OD EDGE HAS 0.063 IN. RADIUS; USED AGAINST DIAPHRAGM WITH VALVE DISK ON OTHER SIDE OF DIAPHRAGM
41017-28GENERAL CHARACTERISTICS ITEM DESCRIPTION: B0.827 IN. O/A OD,0.412 IN. SMALLEST OD,0.068 IN. THK LARGEST OD,0.092 IN. THK SMALLEST OD,LARGE ST OD EDGE HAS 0.063 IN. RADIUS; USED AGAINST DIAPHRAGM WITH VALVE DISK ON OTHER SIDE OF DIAPHRAGM
5210-40Pad Spring
6210-40Pad Spring
749m61-36pc30Pad Spring
852185-1Pad Spring
952185-1Pad Spring
1052185-1Pad Spring
1152185-1Pad Spring
12601r31050-91Pad Spring
13601r31050-91Pad Spring
14601r31050-93Pad Spring
15601r31050-93Pad, Spring
16601r31050-91Pad Spring
17601r31050-91Pad Spring
18601r31050-93Pad Spring
19601r31050-93Pad Spring
20644-0050-001Pad Spring

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